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HYG804R04003A

Product Image
HYG804R04003A
Product Details
Layer: 4L
Base Material: FR4 TG170 Shengyi S1000-2
Board Thickness: 1.575mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 103.8*18.96
Panel Size(mm): 163.89*230.43
Min W/S(mil): 6/5
Min Hole Size: 0.203mm
Special Request: BGA
Production Process

ISO Certification

UL Certification

Application areas

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FAQ
  • Can you offer me better payment term (OA 30/45/60 DAYS)?
  • It depends on customer credit and their company finance. In general, we suggest start with prepayment for some testing order to get credit record. OA term can be released step by step according to cooperation situation.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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