HYG806RF04064A

Product Image

Product Details

Layer: 4L
Base Material: FR4 TG180℃+PI
Board Thickness: Rigid Area: 1.0±0.1mm;
Flex Area: 0.18±0.03mm
Final Copper Thickness: 18/35um
Base Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 61.70*45.40
Min. W/S(mil): 5.9/5.9
Min. Hole Size: 0.2mm
Solder Mask: Green+Yellow coverlay

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Are you a manufacturer (Factory) or trading company?
HoYoGo is a manufacturer with a mass production of 500000 sqm factory and a medium-size production for small-medium volume. Our UL No. is E493066.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com