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HYG807R06029B

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HYG807R06029B
Product Details
Special Request: Impedance Control+BGA 
Layer: 6L 
Base Material: FR4 
Board Thickness: 1.6mm 
Final Copper Thickness: 1OZ 
Surface Finished: ENIG 
Unit Size(mm): 115.0*96.0 
Panel Size(mm): 129.0*208.0 
Min W/S(mil): 3/3 
Min Hole Size: 0.2mm 
Production Process

ISO Certification

UL Certification

Application areas

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FAQ
Can you update a WIP to us every day?
Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

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Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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