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HYG807R06029D

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HYG807R06029D
Product Details
Layer: 6L 
Base Material: FR4 
Board Thickness: 1.6mm 
Final Copper Thickness: 1OZ 
Surface Finished: ENIG+Impedance control 
Unit Size(mm): 115.0*96.0 
Panel Size(mm): 129.0*208.0 
Min W/S(mil): 3/3 
Min Hole Size: 0.2mm 
Special Request: BGA 
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Will you take charge of the cost in case of a claim for defected PCB or assembled PCB (PCBA)?
  • HoYoGo has strict quality system and standard for our outgoing PCBs and responsible for them after service. In case there is claim, we will give quick response in 30minutes. If it’s our PCB’s defect after analysis, we will give solution and pay all the related cost.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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