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Products

HYG885F02025A

Product Image
HYG885F02025A
Product Details
Layer: 2L
Base Material: PI(CND2200MXI: 18Cu/20AD/50PI/20AD/18Cu)
Board Thickness: 0.25mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 233.51*147.28
Min W/S(mil): 11.8/5.9
Min Hole Size: 0.3mm
Solder Mask: Black Coverlay
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Is there UL certificate for your flexible board?
  • YES. We can offer UL certificate of FPC.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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