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Products

HYG885R04018A

Product Image
HYG885R04018A
Product Details
Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+Peelable Mask
Unit Size(mm): 51.0*51.0
Panel Size(mm): 250.0*180.0
Dielectric Layer Thickness≥300um
L1-->L2,L3-->L4 no less than 2 pp
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Can you offer me better payment term (OA 30/45/60 DAYS)?
  • It depends on customer credit and their company finance. In general, we suggest start with prepayment for some testing order to get credit record. OA term can be released step by step according to cooperation situation.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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