HYG885R04027A

Product Image

Product Details

Special Request:
1. IPC-A600 Class 3 / IPC-6012 Class 3;
2. Inner Layer Final Copper Thickness: Min. 86.6um,
Outer Layer Final Copper Thickness: Min. 113.6um;
3. Solder Mask Thickness: Min. 10um;
4. Plated Through Hole Copper Wall Thickness: Average 25um;
5. PTH Φ 1.45mm +/-0.05mm.

Layer: 4L
Base Material: FR4 TG≥150
Board Thickness: 2.6mm
Surface Finished: HASL Lead Free
Unit Size(mm): 200.00*180.00

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com