HYG892R04205A
Product Image
Product Details
Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 100.08*258.83
Panel Size(mm): 208.15*262.83
Solder Mask: Green Matt
Production Process
ISO Certification
UL Certification
Application areas
Who will be our parters
FAQ
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What’s your main material type?
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KB, SY, NY, ITEQ, TUC, Ventec, etc.
Contact us
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.