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Products

HYG892R04350A

Product Image
HYG892R04350A
Product Details
Surface Finished: ENIG+Gold Finger 
Gold Thickness: 30U", Nickel Thickness: 157.52U" 
Layer: 4L 
Base Material: FR4 
Board Thickness: 0.5mm 
Final Copper Thickness: 1OZ 
Unit Size(mm): 116.68*167.64 
Panel Size(mm): 233.36*178.0 
Min W/S(mil): 5.9/5 
Min Hole Size: 0.2mm 
Special Request: BGA 
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
Can you produce board of gold finger?
Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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