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HYG892R04350A

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HYG892R04350A

Product Details

Surface Finished: ENIG+Gold Finger
Gold Thickness: 30U", Nickel Thickness: 157.52U"
Layer: 4L
Base Material: FR4
Board Thickness: 0.5mm
Final Copper Thickness: 1OZ
Unit Size(mm): 116.68*167.64
Panel Size(mm): 233.36*178.0
Min W/S(mil): 5.9/5
Min Hole Size: 0.2mm
Special Request: BGA

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FAQ

Can you produce board of gold finger?
Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.

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