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HYG896F02028A

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HYG896F02028A

Product Details

Special Request:
Finger Stiffener+Total Stiffener Thickness: 0.32+/-0.03mm;
The other two stiffener+Total FPC Thickness: 0.3+/-0.03mm

Layer: 2L
Base Material: PI
Board Thickness: 0.23mm±0.03mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 125.00*16.80
Min Hole Size: 0.3mm
Solder Mask: Yellow coverlay

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ISO Certification

UL Certification

Application areas

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FAQ

Can you produce board of gold finger?
Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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