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HYG898F02308A

Product Image

HYG898F02308A

Product Details

Special Request:
1. 2 FR4 stiffener on the BOT surface;
2. Stiffener Thickness: 0.8mm;
3. FPC+FR4 Stiffener Thickness: 0.9+/-0.1mm.

Layer: 2L
Base Material: PI
Board Thickness: 0.11mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 62.50*15.00
Min W/S(mil): 7.87/7.87
Min Hole Size: 0.2mm
Solder Mask: Yellow coverlay

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Is there UL certificate for your flexible board?
YES. We can offer UL certificate of FPC.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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