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Products

HYG898R04311B

Product Image
HYG898R04311B
Product Details
Special Request: Vias Plugged with Resin+Electroplate Flattened 
Layer: 4L 
Base Material: FR4 

Board Thickness: 1.6mm 
Final Copper Thickness: 1OZ 
Surface Finished: ENIG 
Unit Size(mm): 61.50*26.50 
Min Hole Size: 0.25mm 
Production Process
 

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • What’s kind of PCB can you produce?
  • Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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