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Products

HYG898R10250A

Product Image
HYG898R10250A
Product Details
Special Request: BGA 
Layer: 10L 
Base Material: FR4 TG170 
Board Thickness: 1.4mm 
Final Copper Thickness: 1OZ 
Surface Finished: ENIG 
Unit Size(mm): 154.5*108.0 
Min W/S(mil): 4.3/4 
Min Hole Size: 0.2mm 
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Can you offer DAP … term?
  • DAP is the old DDU from intercoms 2000. So we will follow this as Delivery Duty Unpaid.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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