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Products

HYG902R04018A

Product Image
HYG902R04018A
Product Details
Special Request: 
1. Plated Through Hole Copper Wall Thickness: Average: Min. 25um
2. Tin Thickness: Min. 2um

Layer: 4L
Base Material: FR4 TG170 CTI>175
Board Thickness: 1.52mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 244.48*152.40
Solder Mask: Blue
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • What’s your most advantage of your supply?
  • @Standard mass production (>50sqm) from 1~8layer can be with very good price.
    @ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
    @ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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