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Products

HYG905R12008A

Product Image
HYG905R12008A
Product Details
Layer: 12L
Base Material: FR4 TG170
Board Thickness: 1.85mm
Final Copper Thickness: 1/H/H/H/H/1/1/H/H/H/H/1 OZ
Surface Finished: ENIG+Impedance
Unit Size(mm): 251.46*226.82
Panel Size(mm): 251.46*245.87
Min W/S(mil): 4/4
Min Hole Size: 0.18mm
Special Request: Vias Plugged with Resin
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • What’s kind of PCB can you produce?
  • Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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