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High Density Interconnector PCB

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High Density Interconnector PCB
High Density Interconnector PCB
Product Details
High density PCB 
Special Request: Blind buried via 
Layer: 6L 
Base Material: FR4 TG170 
Board Thickness: 1.54mm 
Final Copper Thickness: 1OZ 
Surface Finished: ENIG 
Unit Size(mm): 90.0*50.0 
Panel Size(mm): 195.0*102.0 
Min W/S(mil): 3.4*5.37 
Min Hole Size: 0.15mm 
Special Request: Impedance Control 
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • What’s kind of PCB can you produce?
  • Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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