


| Code | HYG088R00005C | Customer PN |
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| Layer | 1 | Blind/Buried Via | NO |
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| Base Material | FR4 | Unit Size(mm) | 77.0500 | X |
177.0200 |
| Board thickness | 1.0mm | Panle Size(mm) | 77.0500 | X |
177.0200 |
| Min hole | / | Pcs/Panle | 1 | X | 1 |
| Total Holes | / | Copper OZ(finish) | 1OZ | Base Cu | / |
| W/S(mil) | / | Min Hole Copper Thickness | 20um |
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| Outline Finish | CNC | Finish thickness tolerance | +/-10% |
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| Contour tolerance | +/-0.13mm |
Surface Finishing |
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| X-out | / | Solder Mask | White |
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| Special request | / | Silkscreen | Black |
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Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.