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10L HDI PCB

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10L HDI PCB
Product Details

Layer : 10L

Base Material : FR4 TG150

Stack-Up : 2 Step(2+6+2)

Board Thickness : 0.8mm

Surface Finished : ENIG+OSP

Min Hole Size : 0.1mm

Application : Intelligent Mobile Phone

Production process

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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