


| Code | HYG1281F02002A | Customer PN |  |  |  | 
| Layer | 2 | Blind/Buried Via | NO |  |  | 
| Base Material | PI,ITEQ | Unit Size(mm) | 5.7200 | X | 36.0400 | 
| Board thickness | 0.23mm | Panle Size(mm) | / | X | / | 
| Min hole | 0.3mm | Pcs/Panle | / | X | / | 
| Total Holes | 26/PCS | Copper OZ(finish) | 1OZ | Base Cu | / | 
| W/S(mil) | 6.3/42.7 | Min Hole Copper Thickness | 20um |  |  | 
| Outline Finish | Lasering | Finish thickness tolerance | +/-0.05mm |  |  | 
| Contour tolerance | +/-0.15mm | Surface Finishing | ENIG Thickness |  |  | 
| X-out | / | Solder Mask | Yellow |  |  | 
| Special request | / | Silkscreen | White |  | 
	 
 
	 
 
	 
 
	 
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.
	
