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HYG1281F02002A

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HYG1281F02002A
HYG1281F02002A
Production process

Specification
Code HYG1281F02002A Customer PN


Layer 2 Blind/Buried Via NO

Base Material PI,ITEQ Unit Size(mm) 5.7200
X 36.0400
Board thickness 0.23mm Panle Size(mm) /
X /
Min hole 0.3mm
Pcs/Panle / X /
Total Holes 26/PCS Copper OZ(finish) 1OZ Base Cu /
W/S(mil) 6.3/42.7 Min Hole Copper Thickness 20um

Outline Finish Lasering
Finish thickness tolerance +/-0.05mm

Contour tolerance +/-0.15mm Surface Finishing
ENIG Thickness

X-out / Solder Mask Yellow

Special request / Silkscreen White
Customer Evaluation
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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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