


| Code | HYG1281F02001A | Customer PN |
|
|
|
| Layer | 2 | Blind/Buried Via | NO |
|
|
| Base Material | PI | Unit Size(mm) |
18.0000 |
X | 58.6500 |
| Board thickness | 0.32mm | Panle Size(mm) |
/ |
X | / |
| Min hole |
1.0mm |
Pcs/Panle | 1 | X | 1 |
| Total Holes | 4 | Copper OZ(finish) | 1OZ | Base Cu | / |
| W/S(mil) | 11.8/7.9 | Min Hole Copper Thickness | 20um |
|
|
| Outline Finish |
CNC |
Finish thickness tolerance | +/-10% |
|
|
| Contour tolerance | +/-0.1mm |
Surface Finishing |
ENIG Thickness |
|
|
| X-out | / | Solder Mask |
/ |
|
|
| Special request | / | Silkscreen | / |
|
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.