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HYG1281F02001A

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HYG1281F02001A
HYG1281F02001A
Production process

Specification
Code HYG1281F02001A Customer PN


Layer 2 Blind/Buried Via NO

Base Material PI Unit Size(mm) 18.0000
X 58.6500
Board thickness 0.32mm Panle Size(mm) /
X /
Min hole 1.0mm
Pcs/Panle 1 X 1
Total Holes 4 Copper OZ(finish) 1OZ Base Cu /
W/S(mil) 11.8/7.9 Min Hole Copper Thickness 20um

Outline Finish CNC
Finish thickness tolerance +/-10%

Contour tolerance +/-0.1mm Surface Finishing
ENIG Thickness

X-out / Solder Mask /


Special request / Silkscreen /
Customer Evaluation
20170809113338_62641_副本_副本.jpg 20170809115057_80100_副本.jpg one.jpg 20170809115226_98108_副本.jpg

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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