2 L FR4 HASL Lead Free Red

Surface treatments

1.Hot Air Levelling (HAL)................Sn/Pb 63/37 or Sn Lead-Free- Thk 4u / 10u

2.Chemical Nickel/ Gold ................ gold flash :min. 0.07/ max 0.15u Thk on 4/5u nickel Thk;

                           gold :-95.5% (23 carats ), hardness -150 Knoop

                           nickel:hardness ( kg / mm2) 570 HK 100

3.Chemical tin ..........................Elga Europe or Atotech Tin - min. Thk 0.8 / max 1.4u

4.Electrolytic Nickel / Gold ........... gold :min. 0.8/ max 1.2u Thk on 4/5u nickel Thk;

                           gold : -95.5% (23 carats ), hardness -150 Knoop

                           nickel:hardness ( kg / mm2) 570 HK 100

Products List 

HOYOGO can support all your pcb requirements from simple single sided conventional FR4 pcbs  to complex exotic HDI requirements and PCB assembly.

• Conventional FR4 1 to 56 layer

• High TG and or heavy copper

• High frequency exotic substrate

• HDI

• Gold finger

• Hard gold plating

• Flexible pcb

• Rigid‐Flex pcb

• IMS pcb (Aluminum, copper base/core)

• Medical requirements ‐ ISO13485 certified suppliers

• Automotive requirements – TS16949 certified suppliers

• Standard and quick turn to 3 days available

PCB components

Printed circuit boards are mainly composed of pads, vias, mounting holes, wires, components, connectors, fillers, electrical boundaries, etc. The main functions of each component are as follows:

1.Pads: Metal holes used to solder component pins.

2.Via: Metal hole used to connect component pins between layers.

3.Mounting hole: Used to fix the printed circuit board.

4.Conductor: An electrical network copper film used to connect component pins.

5.Connectors: Components used to connect between circuit boards.

6.Fill: The copper used for the ground network can effectively reduce the impedance.

7.Electrical Boundary: Used to determine the size of the circuit board. Components on all circuit boards must not exceed this boundary.