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HYG1009R04006A

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HYG1009R04006A
HYG1009R04006A
Production process


Specification
Code HYG1009R04006A Customer PN


Layer 4 Blind/Buried Via NO

Base Material FR4 KB6160 TG140 Unit Size(mm) 32.0000 X 56.0000
Board thickness 1.54mm Panle Size(mm) 230.0000
 X 296.0000
Min hole 0.25mm
 Pcs/Panle 4 X 5
Total Holes 15084/SET Copper OZ(finish) 1OZ
 Base Cu /
W/S(mil) 7.8/6 Min Hole Copper Thickness 25um

Outline Finish CNC Finish thickness tolerance +/-0.10%

Contour tolerance +/-0.15mm Surface Finishing
 ENIG Thickness

X-out / Solder Mask Green

Special request / Silkscreen White

ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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