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HYG088F04002B

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HYG088F04002B
HYG088F04002B
HYG088F04002B
HYG088F04002B
Production process

Specification
Code HYG088F04002B Customer PN


Layer 4 Blind/Buried Via NO

Base Material FR4 Unit Size(mm) 105.0000
X 13.0000
Board thickness 0.2mm Panle Size(mm) /
X /
Min hole 0.250mm
Pcs/Panle / X /
Total Holes 1856 Copper OZ(finish) 45um
Base Cu /
W/S(mil) 4.7/3.6 Min Hole Copper Thickness 20-25um

Outline Finish CNC+V-CUT Finish thickness tolerance +/-10%

Contour tolerance +/-0.1mm Surface Finishing
ENIG Thickness

X-out / Solder Mask Green


Special request / Silkscreen White

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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