




| Code | HYG088F04002B | Customer PN |
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|
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| Layer | 4 | Blind/Buried Via | NO |
|
|
| Base Material | FR4 | Unit Size(mm) |
105.0000 |
X |
13.0000 |
| Board thickness | 0.2mm | Panle Size(mm) |
/ |
X | / |
| Min hole |
0.250mm |
Pcs/Panle | / | X |
/ |
| Total Holes | 1856 | Copper OZ(finish) |
45um |
Base Cu | / |
| W/S(mil) | 4.7/3.6 | Min Hole Copper Thickness | 20-25um |
|
|
| Outline Finish | CNC+V-CUT | Finish thickness tolerance | +/-10% |
|
|
| Contour tolerance | +/-0.1mm |
Surface Finishing |
ENIG Thickness |
|
|
| X-out | / | Solder Mask |
Green |
|
|
| Special request | / | Silkscreen | White |
|
|
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.