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HYG892R04220A

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HYG892R04220A
HYG892R04220A
Product Details


Production process

Specification
Layer 4 Base material FR4
Board Thickness 0.8mm Min hole size 0.3mm
Total Holes 234/set Outline Finish CNC+V-CUT
Min Hole Copper Thichness 20um X-out 1
Surface Finishing ENIG Thickness:2u''mi Solder Mask Blue
Silkscreen yes Finish thickness tolerance +/-10%

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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