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HYG528R06061A

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HYG528R06061A
HYG528R06061A
Production process


Specification
Code HYG528R06061A Customer PN


Layer 6 Blind/Buried Via NO

Base Material FR4 Unit Size(mm) 86.0000 X 75.9000
Board thickness 1.6mm Panle Size(mm) 100.0000
X 230.9000
Min hole 0.250mm
Pcs/Panle 1 X 3
Total Holes 1856 Copper OZ(finish) 45um
Base Cu /
W/S(mil) 4.7/3.6 Min Hole Copper Thickness 20-25um

Outline Finish CNC+V-CUT Finish thickness tolerance +/-0.14

Contour tolerance +/-0.1mm Surface Finishing
ENIG Thickness

X-out EQ Solder Mask Green


Special request / Silkscreen White

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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