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HYG068R00047A

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HYG068R00047A
Production process


Specification
Code HYG068R00047A Customer PN


Layer Bare plate Blind/Buried Via NO

Base Material FR4 Unit Size(mm) 20.0000 X 63.5000
Board thickness 1.2mm Panle Size(mm) 100.0000 X 127.0000
Min hole / Pcs/Panle 1 X 1
Total Holes / Copper OZ(finish) 1OZ Base Cu /
W/S(mil) / Min Hole Copper Thickness 20um

Outline Finish CNC Finish thickness tolerance +/-0.12mm

Contour tolerance +/-0.5mm Surface Finishing
 Bare plate

X-out / Solder Mask /

Special request / Silkscreen /

ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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