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HYG068R01030A

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HYG068R01030A
Production process

Specification
Code HYG068R01030A Customer PN


Layer 1 Blind/Buried Via NO

Base Material CEM1 Unit Size(mm) 285.2000
 X 11.5000
Board thickness 1.50mm Panle Size(mm) 285.2000 X 131.0000
Min hole / Pcs/Panle 1 X 1
Total Holes / Copper OZ(finish) 1OZ Base Cu /
W/S(mil) / Min Hole Copper Thickness 35u

Outline Finish E-Test
 Finish thickness tolerance +/-10%

Contour tolerance +/-0.13mm Surface Finishing
 HASL LeadFree

X-out / Solder Mask White

Special request / Silkscreen Black

ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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