Communication Application PCB

Product Image

Product Details

Layer : 6L

Base Material : FR4

Stack-Up : 1 Step(1+4+1)

Board Thickness : 1.2mm

Surface Finished : ENIG

Min Hole Size : 0.15mm

Application : Communication

Production process

ISO Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 8F, Second-A Building, Daji Hui Innovation Industrial Center, Shajing Street Bao'an District, Shenzhen. 518104/ P.R.C.