

| Code | HYG002AF01003A | Customer PN |
|
|
|
| Layer | 1 | Blind/Buried Via | NO |
|
|
| Base Material |
FR4+Alu |
Unit Size(mm) | 75.0000 | X |
193.0000 |
| Board thickness | 1.73mm | Panle Size(mm) |
/ |
X |
/ |
| Min hole | 0.45mm | Pcs/Panle | 1 | X | 1 |
| Total Holes | / | Copper OZ(finish) | 1OZ | Base Cu | / |
| W/S(mil) |
/ |
Min Hole Copper Thickness | 20um |
|
|
| Outline Finish |
CNC |
Finish thickness tolerance | +/-10% |
|
|
| Contour tolerance | +0.15mm |
Surface Finishing |
ENIG Thickness2u" |
|
|
| X-out |
|
Solder Mask | Green |
|
|
| Special request |
|
Silkscreen | White |
|
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.