


| Code | HYG002AF03001A | Customer PN | 
				 | 
			
				 | 
			
				 | 
		
| Layer | 3 | Blind/Buried Via | NO | 
				 | 
			
				 | 
		
| Base Material | 
				Alu+FR4   | 
			Unit Size(mm) | 
				110.0000 | 
			X | 
				112.2000 | 
		
| Board thickness | 1.6mm | Panle Size(mm) | / | X | / | 
| Min hole | 0.7mm | Pcs/Panle | 1 | X | 1 | 
| Total Holes | 
				/ | 
			Copper OZ(finish) | 1OZ | Base Cu | / | 
| W/S(mil) | 3/3mil | Min Hole Copper Thickness | 20um | 
				 | 
			
				 | 
		
| Outline Finish | 
				CNC | 
			Finish thickness tolerance | +/-10% | 
				 | 
			
				 | 
		
| Contour tolerance | +0.15mm | 
				Surface Finishing | 
			ENIG Thickness5u" | 
				 | 
			
				 | 
		
| X-out | 
				 | 
			Solder Mask | White | 
				 | 
			
				 | 
		
| Special request | 
				 | 
			Silkscreen | Black | 
				 | 
			
				 | 
		
	
 
	
 
	
 
	
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.