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HYG026R02009B

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HYG026R02009B
HYG026R02009B
Product Details

Layer : 2L

Base Material : FR4

Board Thickness : 1.57mm

Final Copper Thickness : 2OZ

Surface Finished : ENIG+Gold Finger

Unit Size(mm) : 101.59*101.59

Panel Size(mm) : 218.44*218.44

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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