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Products

HYG026R04033A

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HYG026R04033A
Product Details

Layer: 4L

Base Material: FR4 TG170

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG

Unit Size(mm): 156.6*224.0

Panel Size(mm): 180.6*234.0

Min W/S(mil): 5.2/6.3

Min Hole Size: 0.35mm

Special Request: Impedance Control

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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