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HYG088R02021F|High Temperature Adhesive

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HYG088R02021F|High Temperature Adhesive
HYG088R02021F|High Temperature Adhesive
Product Details

Layer : 2L

Base Material : FR4 TUC TU768

Board Thickness : 1.6mm

Final Copper Thickness : 1OZ

Surface Finished : Immersion Tin

Unit Size(mm) : 98.5*118.5

Panel Size(mm) : 243.0*301.5

Min W/S(mil) : 7.87

Min Hole Size : 0.3mm

Solder Mask : Dark Green

Peelable Mask+High Temperature Adhesive

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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