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Products

HYG088R04039B

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HYG088R04039B
Product Details

Layer: 4L

Base Material: FR4 TUC TU768

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: Immersion Tin

Unit Size(mm): 30.0*24.0

Panel Size(mm): 158.0*118.0

Min Hole Size: 0.3mm

Solder Mask: PSR-4000 SN10

Solder Mask Thickness: 10-30um

Production process

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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