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HYG089R02006B

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HYG089R02006B
Product Details

Layer: 2L

Base Material: FR4

Board Thickness: 1.5mm

Final Copper Thickness: 3OZ

Surface Finished: HASL Lead Free

Unit Size(mm): 24.8*86.1

Panel Size(mm): 297.6*.86.1

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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