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HYG089R02017A

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HYG089R02017A
HYG089R02017A
Product Details

Layer : 2L

Base Material : FR4

Board Thickness : 0.9mm

Final Copper Thickness : 2OZ

Surface Finished : HASL Lead Free

Unit Size(mm) : 100*50

Panel Size(mm) : 300*120

Solder Mask : Black

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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