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HYG1103F02015B|FPC

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HYG1103F02015B|FPC
HYG1103F02015B|FPC
Product Details

Layer : 2L

Base Material : PI

Board Thickness : 0.15mm

Min Hole Copper Thickness : 20um

Final Copper Thickness : 1OZ

Surface Finishing: ENIG/Gold finger

Unit Size(mm) : 58.0*16.46

Panel Size(mm) : 58.0*16.46

W/S(mil) : 9.8/7.8

Solder Mask : Yellow Coverlay

Special requirements:PI reinforcement;FPC total thickness:0.3+-0.05mm (including reinforcement);no added UL and cycle Au: 0.06;Ni:3um(min);Finger position hard thick gold (gold thickness 0.8um), accept lead residue

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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