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HYG1103R02004

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HYG1103R02004
HYG1103R02004
Product Details


Production process

Specification
Code HYG1103R02004A Customer PN /

Layer 2 Blind/Buried Via NO

Base Material FR4 TG130/140 Unit Size(mm) 375.0000 X 25.0000
Board thickness 1.6 Panle Size(mm) 395.0000 X 268.0000
Min hole / Pcs/Panle 1 X 10
Total Holes / Copper OZ(finish) 2OZ Base Cu /
W/S(mil) / Min Hole Copper Thickness /

Outline Finish CNC+V-CUT Finish thickness tolerance +/-10%

Contour tolerance +/-0.13MM Customer' Specifications HYG

X-out 1 Solder Mask White

Special request 3 Tool holes Silkscreen Black

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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