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HYG1103R02021A

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HYG1103R02021A
HYG1103R02021A
Product Details

Layer : 2L with NPTH

Base Material : FR4

Board Thickness : 0.33mm

Final Copper Thickness : 1OZ

Surface Finished : ENIG+Gold Finger

Unit Size(mm) : 94.15*16.00

Min W/S(mil) : 11.8/11.8

Solder Mask : Yellow Coverlay

Stiffener Size : 5.0±0.5mm

ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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