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HYG1103R04016A

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HYG1103R04016A
HYG1103R04016A
Product Details

Layer : 6L

Base Material : FR4 TG150

Board Thickness : 1.65mm

Surface Finished : ENIG+Gold Finger

Unit Size(mm) : 60.0*79.0

Panel Size(mm) : 247.0*300.0

Min W/S(mil) : 7.9/7.9

Min Hole Size : 0.3mm

Solder Mask Thickness : Trace Edge 7um(min); Trace Surface 10um(min)

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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