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Products

HYG1280R02002A

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HYG1280R02002A
HYG1280R02002A
Production process

Specification
Code HYG1280R02002A Customer?PN /

Layer 2 Blind/Buried?Via NO

Base?Material RF4(cti>600)+ALU Unit?Size(mm) 527.0500 X 94.1800
Board?thickness 1.65 Panle?Size(mm) 209.0750 X 527.0500
Min?hole 0.25MM Pcs/Panle 1 X 2
Total?Holes 5818 Copper?OZ(finish) 2OZ Base?Cu /
W/S(mil) 10/10 Min?Hole?Copper?Thickness 20um

Outline?Finish CNC Finish?thickness?tolerance +/10%

Contour?tolerance +/-0.15MM Customer'?Specifications HYG


X-out / Solder?Mask ENIG Thickness 2u"mi
Special?request / Silkscreen White

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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