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HYG1281F02026A

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HYG1281F02026A
HYG1281F02026A
HYG1281F02026A
Product Details

Layer : 2L

Base Material : PI

Board Thickness : 0.2mm

Final Copper Thickness : 18UM

Surface Finished : ENIG

Unit Size(mm) : 260.0*15.6

Min W/S(mil) : 3.94/4

Min Hole Size : 0.1mm

Solder Mask : Yellow Coverlay

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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