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Products

HYG1281RF06024A

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HYG1281RF06024A
HYG1281RF06024A
Product Details

Rigid-Flex PCB

Layer : 6L

Base Material : FR4 TG170+PI

Rigid Board Thickness : 0.75mm

Flex Board Thickness : 0.2mm

Final Copper Thickness : 1OZ

Surface Finished : ENIG

Unit Size(mm) : 79.71*41.33

Panel Size(mm) : 88.49*55.42

Min Hole Size : 0.15mm

Production process

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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