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HYG168R02012A

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HYG168R02012A
Product Details

Layer: 2L

Base Material: FR4

Board Thickness : 1.6mm

Final Copper Thickness: 3OZ

Surface Finished: HASL Lead Free

Unit Size(mm): 84.0*52.3

Panel Size(mm): 94.0*106.6

Solder Mask: Blue

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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