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HYG293R02011A

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HYG293R02011A
Product Details


Production process

Specification
Code HYG293R02011A Customer PN /

Layer 2 Blind/Buried Via /

Base Material FR4 Unit Size(mm) 52.0000 X 100.0000
Board thickness 2 Panle Size(mm) / X /
Min hole 0.6MM Pcs/Panle 1 X 1
Total Holes 291 Copper OZ(finish) 2OZ Base Cu /
W/S(mil) / Min Hole Copper Thickness 20UM

Outline Finish CNC Finish thickness tolerance +/-10%

Contour tolerance +/-0.15MM Customer' Specifications HYG

X-out / Solder Mask Green

Special request / Silkscreen /

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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