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HYG293R04003B

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HYG293R04003B
Product Details

Layer: 4L

Base Material: FR4 CT1≥175

Board Thickness: 2.0mm

Final Copper Thickness: 2OZ

Surface Finished: ENIG

Unit Size(mm): 92.99*48.01

Panel Size(mm): 109.0*268.0

Min Hole Size: 0.2mm

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ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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