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HYG528F02159

Product Image
HYG528F02159
HYG528F02159
Production process

Specification
Code HYG528F02159 Customer PN


Layer
Blind/Buried Via NO

Base Material SF 302 Unit Size(mm) 401.9500
 X 434.9900
Board thickness
Panle Size(mm)
X
Min hole
Pcs/Panle
X
Total Holes
Copper OZ(finish)
Base Cu
W/S(mil)
Min Hole Copper Thickness


Outline Finish
Finish thickness tolerance +/-10%

Contour tolerance
Surface Finishing


X-out
Solder Mask


Special request


Silkscreen White
Customer Evaluation
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Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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