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HYG528R01337A

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HYG528R01337A
Product Details

Layer: 1L

Base Material: CEM-1 CT1>600

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: OSP

Unit Size(mm): 55.0*280.0

Panel Size(mm): 240.0*280.0

Solder Mask: White

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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