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HYG528R02119A

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HYG528R02119A
Product Details

Layer: 2L

Base Material: FR4

Board Thickness: 2.4mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG+Depth milling

Unit Size(mm): 55.30*103.95

Panel Size(mm): 119.0*284.5

Min Hole Size: 0.3mm

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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