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HYG528R02369A

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HYG528R02369A
Product Details

Layer : 2L with NPTH

Base Material : CEM-3 CTI>=600V

Board Thickness : 1mm

Final Copper Thickness : 1OZ

Surface Finished : OSP

Unit Size(mm) : 243.84*243.84

Panel Size(mm) : 513.588*264.16

Min W/S(mil) : 16/13.9

Solder Mask : white(Brand : PM-500WD-87SF)

Special Process : Plate Bending&Twist 0.7%Solder Mask Thickness : Line Angle 8um(min)V-Cut Remaining Thickness : 0.5mm+/-0.1mm

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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